SK hynix Inc. held a ceremonial groundbreaking recently for its advanced packaging fabrication and R&D facility for AI memory in the Purdue Research Park.
The event featured remarks from Indiana Gov. Mike Braun, U.S. Sen. Todd Young, Purdue University interim President Mitch Daniels, SK hynix CEO Kwak Noh-Jung and other dignitaries.
“Today marks the day when the U.S. and SK hynix embark on a new future of AI together,” Kwak said. “The U.S. is the epicenter of AI innovation, bringing together premier customers, top-tier R&D capabilities and partners. We will expand our investments and collaboration in the U.S., grow together, and become the most trusted partner in shaping the future of AI in America.”
Announced in April 2024, the over $4 billion project marks SK hynix’s first high bandwidth memory production hub established in the U.S. The historic investment into Indiana was propelled by Purdue’s track record of innovation, research excellence, and long-standing success in developing talent and advancing research through partnerships with industry leaders.
Purdue is leading U.S. semiconductor reshoring efforts, launching the nation’s first comprehensive Semiconductor Degrees Program in 2022 to prepare students for careers across the semiconductor industry. Currently, over 800 undergraduate and graduate students are pursuing a semiconductor certificate or departmental concentration or participating in SCalable Asymmetric Lifecycle Engagement (SCALE), the preeminent U.S. program for semiconductor workforce development in the defense sector.
“It’s appropriate that today’s event is called a groundbreaking because it is true in so much more than the physical sense,” Daniels said. “Purdue’s partnership with SK hynix will also provide groundbreaking opportunities for our students, our researchers, our community, our state and our nation as we begin the work of building a more prosperous state and a stronger and more resilient America.”
The West Lafayette fab — industry shorthand for fabrication plant — will support approximately 1,000 employees when production begins.
“This project will usher in the next generation of American innovation, bring thousands of good-paying jobs to Indiana and supercharge regional economic development,” Braun said. “It’s a win for Hoosiers, a win for our economy and a great leap forward for Indiana in the race to be the best in the industries of the future.”
New agreement supports advanced packaging initiatives
At the ceremony, SK hynix signed a partnership framework agreement with Purdue for research and development collaboration in the field of advanced packaging.
Through the partnership, SK hynix will expand its efforts to cultivate and recruit world-class talent from across the Midwest as well as access cutting-edge research and emerging technologies developed through Purdue’s innovation ecosystem. At the heart of Purdue’s research enterprise is the Birck Nanotechnology Center, home to one of the largest academic cleanrooms in the country and 33,000 square feet of specialized laboratories.
Further bolstered by Purdue Research Foundation’s (PRF) world-class intellectual property management and technology commercialization efforts, the company will engage with pioneering semiconductor innovations and accelerate the transition of promising discoveries from lab to marketplace.
“This groundbreaking marks an exciting new chapter in our partnership with SK hynix and reflects a shared commitment to shaping the future of the semiconductor industry, critical for accelerating progress and innovation,” said PRF President and CEO Chad Pittman. “Together we are strengthening the American semiconductor ecosystem, creating new opportunities for talent development and driving economic growth.”
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